Expert Help (917) 480-2682 ext 101

  • Free Shipping For Qualified Orders

  • Expert Instrument Assistance

  • Hassle-Free Returns

  • Unparalleled Customer Care

ENJOY 10% OFF YOUR FIRST ORDER

FIRSTORDER10
Busch & Co. GmbH  |  SKU: 037800

DT5880 095 HP DIATWISTER SUPERCOA - (Pack of 1)

Regular price $46.99

The diamond cylinder super coarse diatwister bur from Busch & Co. GmbH is a precision-engineered rotary instrument designed for demanding material removal tasks across a range of dental and technical disciplines. Featuring a cylinder round form with a super coarse diamond grit, this Diatwister delivers aggressive cutting performance while maintaining control and consistency throughout each application.

Key Features

  • Shape: Cylinder Round
  • Grit: Super Coarse
  • Series: Diatwister (DT5880 095 HP)
  • Diamond abrasive for efficient, high-speed material removal
  • Manufactured in Germany to exacting quality standards

Applications

The diamond cylinder super coarse diatwister bur is well-suited to a variety of professional use cases, including:

  • Plastics Technology — effective shaping and reduction of plastic materials
  • Orthodontics — precise adjustment and finishing in orthodontic workflows
  • Model Making — controlled material removal for detailed technical models

German Engineering

This instrument is proudly made in Germany, reflecting Busch & Co. GmbH's long-standing commitment to manufacturing excellence. As with all instruments in the Diatwister range, the diamond cylinder super coarse diatwister bur is produced to consistent tolerances, ensuring reliable performance across repeated use.

FAQ

What shank type does the DT5880 095 HP use? This instrument is designed for HP (handpiece) compatibility, suitable for straight handpiece applications.

How many instruments are included? This listing is supplied as a pack of 1.

Is this bur suitable for hard materials? The super coarse diamond grit of the diamond cylinder super coarse diatwister bur makes it particularly effective for rapid stock removal on harder substrates in compatible applications.